Heat Pipe + Stamped Fin System
Heat pipes move heat from the source into high-density folded fins for lighting, projectors, and compact electronics.
- Copper heat pipe routing
- Aluminum or copper fin stack
- Custom base and bracket design
Product systems
System-level air cooling built around stamped fin manufacturing.
Each air-cooling system is built around stamped fins, heat pipes, copper bases, machined interfaces, and production-ready assembly methods.
System options
From a single fin stack to complete thermal modules.
Board-level Server Cooling
Low-profile stamped fin coolers combine strong mounting with repeatable fin spacing for dense electronics.
- Spring screw mounting
- Base flatness control
- Airflow direction optimization
Projector Thermal Module
Fin stacks, bases, ducts, and heat pipe structures are integrated for optical engine heat sources.
- Compact envelope design
- Light source heat spreading
- Custom air duct interfaces
Copper Fin Cooling Parts
Compact copper fin structures fit electronics, control units, chargers, and power modules.
- High thermal conductivity
- Custom base geometry
- Controlled fin density
Industrial Power Air Cooling
Forced-air cooling assemblies support power supplies, chargers, inverters, and industrial equipment.
- Large base options
- High fin surface area
- Cost-focused volume production
High-power Lighting Platform
Lighting heat sink platforms can be tuned for different wattages, airflow paths, and enclosure layouts.
- 200 W to 1,200 W references
- Heat pipe assisted design
- Tooling-based fin geometry
Project flow
Simple process for overseas OEM programs.
The project path stays clear: review the requirement, confirm a feasible thermal concept, validate samples, then move into tooling and production.
01
Requirement Review
02
DFM & Thermal Concept
03
Sample & Test
04
Tooling & Production