Stage lighting
Heat pipe and stamped fin modules for high-power COB lights.
Compact heat pipe fin modules support strong heat spreading, low noise, and controlled weight.
Discuss stage lighting coolingApplications
Application-specific cooling for OEM products.
Thermal parts are designed around the product environment, heat path, mounting pressure, airflow direction, noise target, and cost structure.
Industry solutions
Thermal solutions matched to operating environment, airflow, and assembly constraints.
Data centers
Dense fin assemblies for rack electronics and server boards.
Dense fin assemblies provide stable spacing, repeatable mounting, and airflow-compatible geometry for continuous operation.
Discuss data center cooling
AI computing centers
Board-level heat sinks for high-density AI hardware.
AI accelerators and processor boards need compact heat sinks, reliable pressure control, and predictable thermal performance.
Discuss AI hardware cooling
New energy vehicles
Copper and aluminum cooling parts for vehicle electronics.
Custom bases, stamped fins, and copper parts can be developed for power modules, chargers, lighting systems, and control units.
Discuss EV thermal parts
Medical equipment
Vapor chamber heat spreaders for compact medical electronics.
Compact heat spreaders fit medical electronics where quiet operation, clean interfaces, and quality records matter.
Discuss medical equipment cooling
Telecom equipment
Heat pipe fin systems for communication hardware.
Compact thermal assemblies are matched to telecom airflow paths, enclosure limits, and long operating duty cycles.
Discuss telecom cooling
Energy storage and industrial power
Forced-air cooling hardware for power electronics.
Durable heat sinks and production-stable assemblies serve energy storage, inverters, and industrial power units.
Discuss power electronics cooling